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| (R) EMIF02-MIC03F2 IPADTM 2 LINE EMI FILTER AND ESD PROTECTION MAIN PRODUCT CHARACTERISTICS: Where EMI filtering in ESD sensitive equipment is required : Mobile phones and communication systems Computers, printers and MCU Boards DESCRIPTION The EMIF02-MIC03 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. BENEFITS EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consuming: 1.07 mm x 1.47 mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging COMPLIES WITH THE FOLLOWING STANDARDS: IEC 61000-4-2 Level 4 on input pins 15 kV (air discharge) 8 kV (contact discharge) Level 1 on output pins 2 kV (air discharge) 2 kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 BASIC CELL CONFIGURATION Flip-Chip package PIN CONFIGURATION (bump side) 321 I2 GND O2 O1 I1 A B C Low-pass Filter Input Output Ri/o = 68 Cline = 100 pF GND TM: IPAD is a trademark of STMicroelectronics. GND GND October 2004 REV. 1 1/6 EMIF02-MIC03F2 ABSOLUTE RATINGS (limiting values) Symbol Tj Top Tstg Parameter and test conditions Maximum junction temperature Operating temperature range Storage temperature range Value 125 - 40 to + 85 - 55 to 150 Unit C C C ELECTRICAL CHARACTERISTICS (Tamb = 25 C) Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline IR = 1 mA VRM = 3 V per line Tolerance 20 % VR = 0 V 68 100 Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input & Output Input capacitance per line Test conditions Min. 6 Typ. 8 500 Max. Unit V nA pF IPP VCL VBR VRM IR IRM IRM IR VRM VBR VCL I IPP V Fig. 1: S21 (dB) attenuation measurements and Aplac simulation. 0.00 dB -5.00 -10.00 Fig. 2: Analog crosstalk measurements. 0.00 dB -10.00 -20.00 -15.00 -20.00 -25.00 -30.00 -35.00 -30.00 -40.00 -50.00 -60.00 -40.00 -45.00 -50.00 100.0k -70.00 -80.00 100.0k 1.0M 10.0M f/Hz 100.0M 1.0G 1.0M 10.0M f/Hz 100.0M 1.0G 2/6 (R) EMIF02-MIC03F2 Fig. 3: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and one output V(out). Fig. 4: ESD response to IEC61000-4-2 (-15kV air discharge) on one input V(in) and one output V(out). Fig. 5: Line capacitance versus applied voltage. C(pF) 140 120 100 80 60 40 20 VR(V) F=1MHz Vosc=30mVRMS Tj=25C 0 0 1 2 3 4 5 (R) 3/6 EMIF02-MIC03F2 Aplac model IN1 Rbump Lbump Rmic Lmic Lbump Rbump OUT1 model = D1 model = D2 Rsub GND Lsub GND model = D3 Rbump Lbump model = D1 model = D2 Cgnd Lgnd Rgnd IN2 Rbump Lbump Rmic Lmic Lbump Rbump OUT2 EMIF02-MIC03F1 model Ground return Aplac parameters Model D1 CJO=Cdiode1 BV=7 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.7 VJ=0.6 TT=50n Model D3 CJO=Cdiode3 BV=7 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.12 VJ=0.6 TT=50n Model D2 CJO=Cdiode2 BV=7 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.3 VJ=0.6 TT=50n aplacvar Rmic 68 aplacvar Lmic 10p aplacvar Cdiode1 100pF aplacvar Cdiode2 3.6pF aplacvar Cdiode3 1.17nF aplacvar Lbump 50pH aplacvar Rbump 20m aplacvar Rsub 0.5m aplacvar Rgnd 10m aplacvar Lgnd 50pH aplacvar Cgnd 0.15pF aplacvar Lsub 10pH ORDER CODE EMIF EMI Filter Number of lines yy - xxx zz F x 1: Pitch = 500m Bump = 315m 2: Leadfree Pitch = 500m Bump = 315m Flip Chip x: resistance value (Ohms) z: capacitance value / 10(pF) or Application (3 letters) and Version (2 digits) 4/6 (R) EMIF02-MIC03F2 PACKAGE MECHANICAL DATA FLIP CHIP 500m 10 250m 10 315m 50 650m 50 50 0 m 1.07mm 50m FOOT PRINT RECOMMENDATIONS Copper pad Diameter : 250m recommended , 300m max Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 300m copper pad diameter MARKING Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) 1.47mm 50m 15 E xxz y ww (R) 5/6 EMIF02-MIC03F2 PACKING Dot identifying Pin A1 location 8 0.3 ST E xxz yww ST E xxz yww ST E xxz yww 0.73 0.05 4 0.1 All dimensions in mm User direction of unreeling In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. OTHER INFORMATION Ordering code EMIF02-MIC03F2 Marking FW Package Flip-Chip Weight 2.1 mg Base qty 5000 Delivery mode Tape & reel (7") Note: More packing informations are available in the application notes AN1235: ''Flip-Chip: Package description and recommendations for use'' AN1751: "EMI Filters: Recommendations and measurements" REVISION HISTORY Date 14-Oct-2005 Revision 1 Initial release. Changes Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States www.st.com 6/6 3.5 0.1 1.75 0.1 4 0.1 O 1.5 0.1 (R) |
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